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Product Detail :
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Backend design, Fabrication, Testing and delivery of Multi-core Digital Processing and Control RH ASICs (MDPC) using 65nm/55nm node using RHBD/RHBP CMOS Process MDPC ASIC Physical design, Wafer fabrication, MCM Package development, Radiation Testing
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| Tender Detail : |
Backend design, Fabrication, Testing and delivery of Multi-core Digital Processing and Control RH ASICs (MDPC) using 65nm/55nm node using RHBD/RHBP CMOS Process |